Rapid heat cure
SEMICOSIL® 988/1K
Manufacturer: WACKER
Ready-to-use one-part heat-curing silicone adhesive for electronics bonding, FIPG/CIPG and chip attachment.
SEMICOSILAdhesives & Sealants
Recommended applications
Electronics assemblyFIPG and CIPG sealingChip bondingHousing and component attachment
Key benefits
Primerless adhesion potential
Low-stress sealing
Easy thixotropic dispensing
Essential technical details
The values shown are typical guidance values and should not be used as product specifications. Confirm the latest Technical Data Sheet, Safety Data Sheet and application suitability before use.
Industries served
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