Solutions
Our team helps translate application conditions into a practical material shortlist for trials and commercial evaluation.
Transfer heat away from batteries, LEDs, processors and power electronics while maintaining electrical insulation.
Substrates, operating temperature, viscosity or flow, cure method, hardness, thermal target, gap size, flame-retardancy requirement, dispensing process and expected volume.
Protect electronics from moisture, vibration, contamination and thermomechanical stress.
Substrates, operating temperature, viscosity or flow, cure method, hardness, thermal target, gap size, flame-retardancy requirement, dispensing process and expected volume.
Bond components, form flexible seals and support durable industrial assembly.
Substrates, operating temperature, viscosity or flow, cure method, hardness, thermal target, gap size, flame-retardancy requirement, dispensing process and expected volume.
Support dielectric isolation, component protection and reliable electrical performance.
Substrates, operating temperature, viscosity or flow, cure method, hardness, thermal target, gap size, flame-retardancy requirement, dispensing process and expected volume.
Protect displays and lighting assemblies while retaining optical clarity and relieving mechanical stress.
Substrates, operating temperature, viscosity or flow, cure method, hardness, thermal target, gap size, flame-retardancy requirement, dispensing process and expected volume.
Create durable hydrophobic protection for porcelain, glass and epoxy insulating equipment in contaminated environments.
Substrates, operating temperature, viscosity or flow, cure method, hardness, thermal target, gap size, flame-retardancy requirement, dispensing process and expected volume.
Support electrical insulation, cell stabilization and protection of high-voltage components under demanding battery conditions.
Substrates, operating temperature, viscosity or flow, cure method, hardness, thermal target, gap size, flame-retardancy requirement, dispensing process and expected volume.